Animal models are important for the investigation of mechanisms and therapeutic approaches in various human diseases, including schizophrenia. Recently, two neurodevelopmental rat models of this psychosis were developed based upon the use of subunit selective N-methyl-D-aspartate receptor agonists - quinolinic acid (QUIN) and N-acetyl-aspartyl-glutamate (NAAG). The aim of this study was to evaluate pain perception in these models. QUIN or NAAG was infused into lateral cerebral ventricles neonatally. In the adulthood, the pain perception was examined. The rats with neonatal brain lesions did not show any significant differences in acute mechanical nociception and in formalin test compared to controls. However, the neonatally lesioned rats exhibited significantly higher pain thresholds in thermal nociception. Increased levels of mechanical hyperalgesia, accompanying the sciatic nerve constriction (neuropathic pain), were also observed in lesioned rats. Although hyperalgesia was more pronounced in QUIN-treated animals, the number of c-Fos-immunoreactive neurons of the lumbar spinal cord was similar in experimental and control rats. We conclude that neonatal brain lesions attenuated the thermal perception in both nociceptive and neuropathic pain whereas mechanical pain was increased in the model of neuropathic pain only. Thus, nociceptive and neuropathic pain belongs - in addition to behavioral changes - among the parameters which are affected in described animal models of schizophrenia., M. Franěk ... [et al.]., and Obsahuje bibliografii a bibliografické odkazy
Pájení je nejpoužívanější metodou při elektronické montáži. Výraznou změnu prodělalo při přechodu na bezolovnaté pájení slitiny. S touto změnou a se stále rostoucí miniaturizací elektrotechnických zařízení je spojena problematika vývoje vhodných slitin, výrobních technologií a podobně. Pájení se postupem doby stalo velmi komplexním procesem, do kterého vstupuje mnoho faktorů ovlivňujícíchvýslednou kvalitu pájeného spoje, a tedy i výrobku. Tento článek se zabývá používanými materiály, pájením a vybranými problémy, které se při něm mohou vyskytnout., Soldering is the most commonly used technique in electronic assembly. A significant change in soldering was the transition to the use of lead-free solder alloys. With this change and increasing miniaturization of electrical equipment comes the associated issue of developing suitable alloys, production technology, etc. Over time soldering has become a very complex process, with many factors affecting the final quality of the solder joints, and thus the product. This article deals with materials used, soldering and selected defects which may occur., Karel Dušek., and Obsahuje seznam literatury